ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

Prix à partir de
11,79

Liens sponsorisés

COMPARER TOUS LES MAGASINS EN LIGNE (1)

Description

ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

Description Description
Product Specifications Spécifications du produit
Résultats connexes Résultats connexes
Next
Previous

Comparer les boutiques en ligne (1)

Liens sponsorisés · Certaines boutiques nous versent une rémunération

Trier par:

11,79 € Total 14,79 €

Description (0)

ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

Spécifications du produit

Marque Independently Published
EAN
  • 9798251122770

Independently Published

ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

12,49 €
Plus d'informations Plus infos

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

184,82 €
Plus d'informations Plus infos

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,73 €
Plus d'informations Plus infos

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

24,42 €
Plus d'informations Plus infos
Choix en vedette
11,79 €
Voir l’offre