Cu Interconnects, Glass, and AI Assisted Simulation for Chiplets Heterogeneous Integration

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Amazon Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
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Description (1)

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

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Marque Springer
EAN
  • 9789819568901

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

136,81 €
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Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

92,00 €
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CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

157,27 €
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AI for Professionals: Judgment and Accountability in Assisted

16,88 €
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