Thermal and Structural Electronic Packaging Analysis for Space Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Marque CRC Press
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  • 9781041216919

Independently Published

ADVANCED MATERIALS FOR EXTREME ENVIRONMENTS: thermal stress corrosion resistance and structural performance

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Institute of Physics Publishing

Electronic Materials and Devices for Extreme Environments

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Institute of Physics Publishing

Electronic Materials and Devices for Extreme Environments

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ASCENT, Center for Technical Knowledge

Creo Simulate 11.0: Structural and Thermal Analysis

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